Mt9m114

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Special offer. See more information about Outbyte and uninstall instructions. The Devid. Drivers are the property and the responsibility of their respective manufacturers, and may also be available for free directly from manufacturers' websites. Drivers may also be available for free directly from manufacturers' websites. Any other third-party products, brands or trademarks listed above are the sole property of their respective owner. No affiliation or endorsement is intended or implied.

Windows 8, Windows 8. Or click to install driver manually Free Download. Camera Sensor MT9M Realtek I2S Audio Codec. Camera Sensor OV Sierra Wireless Location Sensor. Flash LM Camera Sensor IMX Dell Wireless SPI Controller. UART Controller. GpioVirtual Controller. Intel R HD Graphics. GPIO Controller. This is due to differences in package capacitance, inductance, resistance, and trace length.

Functional Specifications The specifications provided in this document are for reference only. All rights reserved. Refer to Table 1 on page 5 and Table 2 on page 7 for a complete list of bond pads and coordinates. The MT9M Imager die does not require the user to determine bond option features.

Bonding these pads could result in a nonfunctional die. Figure 1 on page 3 shows the MT9M typical die connections. For low-noise opera- tion, the MT9M die requires separate supplies for analog and digital power. Storage Requirements Aptina die products are packaged for shipping in a cleanroom environment. Upon receipt, the customer should transfer the die to a similar environment for storage.

Aptina recommends the die be maintained in a filtered nitrogen atmosphere until removed for assembly. ESD damage precautions are necessary during handling. The die must be in an ESD-protected environment at all times for inspection and assembly. This typical configuration shows only one scenario out of multiple possible variations for this sensor. Only one of the output modes serial or parallel can be used at any time.

Aptina Confidential and Proprietary. Image Sensor Die. General Physical Specifications. Consult factory for other die thickness. Die Database. Order Information. Note: Consult die distributor or factory before order-. Form Temp Chrom. Key Performance Parameters. General Description. The Aptina MT9M die is a 1. The MT9M The sensor is a complete camera system-on-a-chip solution and is.

It incorporates multiple sophisticated on-die camera functions and is. The MT9M die is a fully-automatic, single-chip camera, requiring only a power. Output video is streamed through a. Output pixel clock is. MT9M die internal registers can be configured using a two-wire serial interface.

Die Testing Procedures. Aptina imager die products are tested with a standard probe C1 test. Wafer probe is. The probe functional test flow. Test conditions, margins, limits, and test sequence are determined by individual. Aptina retains a wafer map of each wafer as part of the probe records, along with a lot. Aptina reserves the right to change the.

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